Tongfu Microelectronics (通富微电子股份有限公司, formerly known as Nantong Fujitsu Microelectronics) is a company that designs and manufactures integrated circuit (IC) encapsulation test products. It offers flip-chip interconnection devices, system in package (SiP) modules, laminated substrate packaging arrays, outline transistors, etc. The company caters to communication, automotive, technology, industrial, and other sectors.