Tongfu Microelectronics (TFME, 通富微电) is a provider of integrated circuit (IC) assembling and testing services to the semiconductor industry. It offers wafer-level, flip-chip interconnection, ball grid array, plastic quad flat no-lead and dual flat no-lead, small outline, dual-in-line, transistor outline, and plastic single-in-line packaging series products. The company also provides semiconductor testing services such as wafer probing, and strip and system-level testing.