JCET Group (also known as 江苏长电科技股份有限公司, Jiangsu Changjiang Electronics Technology) is a company that provides semiconductor microsystem integration packaging and test. It offers a range of turnkey services, including semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test, and drop shipment to vendors. Its portfolio covers a spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry, etc., through wafer-level packaging, 2.5D/3D, System-in-Packaging, and flip-chip and wire bonding technologies.