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Chipbond Technology Corporation

Chipbond Technology Corporation

Revenue

NT$27.1 B

FY, 2021

Market Capitalization

NT$39.5 B

2022-09-20

Chipbond Technology Corporation Summary

Company summary

Overview
Chipbond Technology (頎邦科技) is a company that provides service for backend assembly processing of LCD driver integrated circuits from wafer grinding to packaging. It offers gold, solder, and cooper bumping, redistribution layer services, and wafer surface processing, wafer grinding, final inspection, chip tray design and manufacturing, and other services.
Type
Public
Founded
1997
HQ
Hsinchu, TW | view all locations
Website
http://www.chipbond.com.tw
Cybersecurity rating
ESG rating
out of 100 | View all ESG data
Sectors

Key people

  • Fei-Jain Wu, Chairman

    • Huoo-Wen Gau, President

      • Robert Hsu, Senior Vice President, Sales/Mkt Planning Center

        • Shyh-Wey Lo, Senior Vice President, Management Center

          LocationsView all

          6 locations detected

          • Hsinchu HQ

            Taiwan

            No. 3, Lixing 5th Road, East District

          • Baoshan

            Taiwan

            No. 15, Yanfa 1st Road, Baoshan

          • Hsinchu

            Taiwan

            No. 10, Zhanye 1st Road, East District

          • Hukou

            Taiwan

            No. 12, Guangfu Road, Hukou Township

          • Kaohsiung, Kaohsiung City

            Taiwan

            No. 11, Nanyi Road, Qianzhen District

          • Kaohsiung, Kaohsiung City

            Taiwan

            No. 5, Nanliu Road, Qianzhen District

          Chipbond Technology Corporation Financials

          Summary financials

          Revenue (Q2, 2022)
          NT$6.6B
          Gross profit (Q2, 2022)
          NT$3.3B
          Net income (Q2, 2022)
          NT$1.8B
          Cash (Q2, 2022)
          NT$6.8B
          EBIT (Q2, 2022)
          NT$2.1B
          Enterprise value
          $37.0B

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