Chipbond Technology Corporation

OverviewSuggest Edit

Chipbond Technology (頎邦科技) is a company that provides service for backend assembly processing of LCD driver ICs (integrated circuits). Its offerings include bumping manufacturing, comprising gold, solder, and cooper bumping; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services.

TypePublic
Founded1997
HQHsinchu, TW
Websitechipbond.com.tw

Locations

Chipbond Technology Corporation is headquartered in
Hsinchu, Taiwan

Location Map

Latest Updates

Employees (est.) (Nov 2020)6,100
Share Price (Oct 2021)NT$62.1(+2%)
Cybersecurity ratingFMore
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Key People/Management at Chipbond Technology Corporation

Fei-Jain Wu

Fei-Jain Wu

Chairman
Huoo-Wen Gau

Huoo-Wen Gau

President
Robert Hsu

Robert Hsu

Senior Vice President, Sales/Mkt Planning Center
Shyh-Wey Lo

Shyh-Wey Lo

Senior Vice President, Management Center
Sheng-jen Wu

Sheng-jen Wu

Senior Vice President, Manufacturing Center
Cheng-hung Shih

Cheng-hung Shih

Vice President, R&D Center & Hukou Operation Center
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Chipbond Technology Corporation Office Locations

Chipbond Technology Corporation has offices in Hsinchu, Baoshan, Hukou and Kaohsiung
Hsinchu, TW (HQ)
No. 3, Lixing 5th Road, East District
Baoshan, TW
No. 15, Yanfa 1st Road, Baoshan
Hsinchu, TW
No. 10, Zhanye 1st Road, East District
Hukou, TW
No. 12, Guangfu Road, Hukou Township
Kaohsiung, TW
No. 11, Nanyi Road, Qianzhen District
Kaohsiung, TW
No. 5, Nanliu Road, Qianzhen District
Show all (6)

Chipbond Technology Corporation Financials and Metrics

Chipbond Technology Corporation Revenue

Market capitalization (15-Oct-2021)

41.7b

Closing stock price (15-Oct-2021)

62.1
Chipbond Technology Corporation's current market capitalization is NT$41.7 b.
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Chipbond Technology Corporation Cybersecurity Score

Cybersecurity ratingPremium dataset

F

59/100

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Chipbond Technology Corporation Online and Social Media Presence

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Chipbond Technology Corporation Frequently Asked Questions

  • When was Chipbond Technology Corporation founded?

    Chipbond Technology Corporation was founded in 1997.

  • Who are Chipbond Technology Corporation key executives?

    Chipbond Technology Corporation's key executives are Fei-Jain Wu, Huoo-Wen Gau and Robert Hsu.

  • How many employees does Chipbond Technology Corporation have?

    Chipbond Technology Corporation has 6,100 employees.

  • Who are Chipbond Technology Corporation competitors?

    Competitors of Chipbond Technology Corporation include Tianshui Huatian Technology, Tongfu Microelectronics and King Yuan Electronics.

  • Where is Chipbond Technology Corporation headquarters?

    Chipbond Technology Corporation headquarters is located at No. 3, Lixing 5th Road, East District, Hsinchu.

  • Where are Chipbond Technology Corporation offices?

    Chipbond Technology Corporation has offices in Hsinchu, Baoshan, Hukou and Kaohsiung.

  • How many offices does Chipbond Technology Corporation have?

    Chipbond Technology Corporation has 6 offices.