Forehope Electronic

Forehope Electronic (Ningbo) Co., Ltd. is a company engaged in the packaging and testing of integrated circuits. It offers system level packaging (SiP), flat pinless packaging (QFN/DFN), high-density fine pitch bump flip chip (FC products), wafer-level packaging (Bumping and WLP), BGA packages, and micro electromechanical system sensors (MEMS). The company serves integrated circuit design companies in China and other countries.