Square Technology Competitors and Similar CompaniesClear all
Lingsen's competitors and similar companies include ChipMOS Technologies and China Wafer Level CSP.
 Lingsen Lingsen Precision Industries (菱生精密工業股份有限公司) is a provider of semiconductor and electronic components. |  ChipMOS Technologies ChipMOS Technologies (南茂科技) is a provider of semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM), and foundries. |  China Wafer Level CSP China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services. | |
Founding Date | Founding Date 1970 | Founding Date 1986 | Founding Date 2005 |
Type | Type Public | Type Public | Type Public |
Tags | |||
Locations | Locations Taichung, TW HQ Milpitas, US | Locations Hsinchu, TW HQ Minhang, CN Hukou Township, TW Tainan, TW Tainan, TW Zhubei, TW Zhubei, TW see more | Locations Suzhou, CN HQ Palo Alto, US |
Employees | Employees 2,8151% decrease | Employees 5,4962% increase | Employees 9974% increase |
Financial | |||
Revenue (est.) | Revenue (est.) NT$5.6b (FY, 2025) | Revenue (est.) NT$23.9b (FY, 2025) | Revenue (est.) ¥1.5b (FY, 2025) |
Cost of goods | Cost of goods NT$4.9b (FY, 2025) | Cost of goods NT$16.2b (FY, 2025) | Cost of goods ¥779.6m (FY, 2025) |
Gross profit | Gross profit NT$705.5m (FY, 2025) | Gross profit NT$7.8b (FY, 2025) | Gross profit ¥684.9m (FY, 2025) |
Net income | Net income (NT$418.1m) (FY, 2025) | Net income NT$495.1m (FY, 2025) | Net income ¥369.3m (FY, 2025) |
For sources of this data, please see the company profile
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ChipMOS Technologies
HQ
Hsinchu, TW
Employees
5,496↑ 2% increase
ChipMOS Technologies (南茂科技) is a provider of semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM), and foundries.
View companyChina Wafer Level CSP
HQ
Suzhou, CN
Employees
997↑ 4% increase
China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services.
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