China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services. It offers wafer-level chip-scale packages (CSPs) for complementary metal–oxide–semiconductor (CMOS) imaging sensors, Radio Frequency Identification (RFID), micro-electromechanical system (MEMS) devices, LED, etc. The company caters to the image sensor, biometric identification, ambient light, medical electronic, and automotive sensor device markets.