ChipMOS Technologies (南茂科技) is a provider of semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM), and foundries. Its service line includes back-end testing services for high-density memory, mixed-signal, and liquid crystal display (LCD) driver semiconductors. In addition, the company offers a selection of lead frame-based and organic substrate-based package assembly services for memory, mixed-signal, and LCD driver semiconductors which are used in diverse end-use markets, including personal computers, communications equipment, office automation, and consumer electronics.