Lingsen Lingsen Precision Industries (菱生精密工業股份有限公司) is a provider of semiconductor and electronic components. | ![]() ChipMOS Technologies ChipMOS Technologies (南茂科技) is a provider of semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM), and foundries. | ![]() China Wafer Level CSP China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services. | Shenzhen Diantong Wintronic Microelectronics Shenzhen Denton Wichuang Microelectronics (also known as 电通微电) is a company engaged in integrated circuit packaging, testing, and MEMS pressure sensor manufacturing. | ||
Founding Date | Founding Date 1986 | Founding Date 1970 | Founding Date 1986 | Founding Date 2005 | Founding Date 2007 |
Type | Type Public | Type Public | Type Public | Type Public | Type Private |
Tags | |||||
Locations | Locations HQ | Locations Taichung, TW HQ Milpitas, US | Locations Hsinchu, TW HQ Minhang, CN Hukou Township, TW Tainan, TW Tainan, TW Zhubei, TW Zhubei, TW see more | Locations Suzhou, CN HQ Palo Alto, US | Locations Shenzhen, CN HQ |
Employees | Employees N/A | Employees 2,8151% decrease | Employees 5,4962% increase | Employees 9974% increase | Employees 287 |
Valuation ($) | Valuation ($) 513.8 m | Valuation ($) N/A | Valuation ($) N/A | Valuation ($) 2.4 b | Valuation ($) N/A |
Financial | |||||
Revenue (est.) | Revenue (est.) ¥1.6b (FY, 2025) | Revenue (est.) NT$5.6b (FY, 2025) | Revenue (est.) NT$23.9b (FY, 2025) | Revenue (est.) ¥1.5b (FY, 2025) | Revenue (est.) N/A |
Cost of goods | Cost of goods ¥1.3b (FY, 2025) | Cost of goods NT$4.9b (FY, 2025) | Cost of goods NT$16.2b (FY, 2025) | Cost of goods ¥779.6m (FY, 2025) | Cost of goods N/A |
Gross profit | Gross profit ¥346.1m (FY, 2025) | Gross profit NT$705.5m (FY, 2025) | Gross profit NT$7.8b (FY, 2025) | Gross profit ¥684.9m (FY, 2025) | Gross profit N/A |
Net income | Net income ¥154.4m (FY, 2025) | Net income (NT$418.1m) (FY, 2025) | Net income NT$495.1m (FY, 2025) | Net income ¥369.3m (FY, 2025) | Net income N/A |
Lingsen Precision Industries (菱生精密工業股份有限公司) is a provider of semiconductor and electronic components.
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ChipMOS Technologies (南茂科技) is a provider of semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM), and foundries.
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China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services.
View companyShenzhen Denton Wichuang Microelectronics (also known as 电通微电) is a company engaged in integrated circuit packaging, testing, and MEMS pressure sensor manufacturing.
View company