Lingsen Lingsen Precision Industries (菱生精密工業股份有限公司) is a provider of semiconductor and electronic components. | ![]() China Wafer Level CSP China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services. | |
Founding Date | Founding Date 1970 | Founding Date 2005 |
Type | Type Public | Type Public |
Tags | ||
Locations | Locations Taichung, TW HQ Milpitas, US | Locations Suzhou, CN HQ Palo Alto, US |
Employees | Employees 2,8151% decrease | Employees 9974% increase |
Financial | ||
Revenue (est.) | Revenue (est.) NT$5.6b (FY, 2025) | Revenue (est.) ¥1.5b (FY, 2025) |
Cost of goods | Cost of goods NT$4.9b (FY, 2025) | Cost of goods ¥779.6m (FY, 2025) |
Gross profit | Gross profit NT$705.5m (FY, 2025) | Gross profit ¥684.9m (FY, 2025) |
Net income | Net income (NT$418.1m) (FY, 2025) | Net income ¥369.3m (FY, 2025) |

China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services.
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