![]() China Wafer Level CSP China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services. | ViTrox ViTrox is a company that manufactures automated vision inspection equipment and system-on-chip embedded electronics devices. | ![]() SG Micro SGMICRO (圣邦微电子(北京)股份有限公司, formerly known as Shengbang Microelectronics (Beijing)) is a company that specializes in the design and manufacturing of integrated circuit chips. | ![]() HT-Tech Tianshui Huatian Technology (TSHT, 天水华天科技股份有限公司) is a company that specializes in integrated circuit packaging and testing. | ![]() Tongfu Microelectronics Tongfu Microelectronics (通富微电子股份有限公司, formerly known as Nantong Fujitsu Microelectronics) is a company that designs and manufactures integrated circuit (IC) encapsulation test products. | ![]() King Yuan Electronics King Yuan Electronics Co. (KYEC, 京元電子公司) is a company that provides test and measurement services for the semiconductor back-end supply chain. | ![]() FormFactor FormFactor is a company that provides electrical and optical test and measurement technologies across stages of the semiconductor lifecycle, including design, characterization, and production. | ![]() Chipbond Chipbond Technology (頎邦科技股份有限公司) is a company that provides backend assembly processing services for LCD driver integrated circuits. | ![]() Orient Semiconductor Electronics Orient Semiconductor Electronics (OSE, 華泰電子) is a company providing integrated circuit (IC) packaging and testing services and electronics manufacturing services (EMS). | ||||
Founding Date | Founding Date 2001 | Founding Date 1976 | Founding Date 2005 | Founding Date 1972 | Founding Date 2000 | Founding Date 2007 | Founding Date 2003 | Founding Date 1997 | Founding Date 1987 | Founding Date 1993 | Founding Date 1997 | Founding Date 1971 |
Type | Type Public | Type Subsidiary | Type Public | Type Private | Type Public | Type Public | Type Public | Type Public | Type Public | Type Public | Type Public | Type Public |
Tags | ||||||||||||
Locations | Locations Asan-si, KR HQ | Locations Suzhou, CN HQ Palo Alto, US | Locations Ipoh, MY HQ Suzhou, CN Ipoh, MY | Locations Bandar Cassia, MY HQ Shenzhen, CN Suzhou, CN Lohr Am Main, DE Cyberjaya, MY Hutto, US | Locations Beijing, CN HQ Chengdu, CN Hangzhou, CN Nanjing, CN Qingdao, CN Shanghai, CN Shanghai, CN see more | Locations Nantong, CN HQ Hefei, CN Nantong, CN Nantong, CN Suzhou, CN Xiamen, CN George Town, MY | Locations Hsin-Chu, TW HQ Suzhou, CN Fukuoka, JP Singapore, SG Miaoli, TW Tongluo, TW San Jose, US | Locations Livermore, US HQ Aschheim, DE Dresden, DE Thiendorf, DE Legnano, IT Yokohama, JP Seongnam, KR see more | Locations Hsinchu, TW HQ Baoshan, TW Hsinchu, TW Hukou, TW Kaohsiung, TW Kaohsiung, TW | Locations Kaohsiung, TW HQ Suzhou, CN Kaohsiung, TW | ||
Employees | Employees 2222% increase | Employees 500 | Employees 9974% increase | Employees 1,266 | Employees 98911% increase | Employees 1,59813% increase | Employees 29,207 | Employees 20,062 | Employees 9,444 | Employees 2,1534% decrease | Employees 5,1882% decrease | Employees 5,1764% increase |
Valuation ($) | Valuation ($) N/A | Valuation ($) N/A | Valuation ($) 2.4 b | Valuation ($) N/A | Valuation ($) N/A | Valuation ($) 5.9 b | Valuation ($) 6 b | Valuation ($) 5.1 b | Valuation ($) N/A | Valuation ($) 3.5 b | Valuation ($) N/A | Valuation ($) N/A |
Financial | ||||||||||||
Revenue (est.) | Revenue (est.) ₩61.7b (FY, 2023) | Revenue (est.) ₩7.2b (FY, 2021) | Revenue (est.) ¥1.5b (FY, 2025) | Revenue (est.) N/A | Revenue (est.) RM843.1m (FY, 2025) | Revenue (est.) ¥3.9b (FY, 2025) | Revenue (est.) ¥16.7b (FY, 2025) | Revenue (est.) ¥27.2b (FY, 2025) | Revenue (est.) NT$34.9b (FY, 2025) | Revenue (est.) $785m (FY, 2025) | Revenue (est.) NT$21.5b (FY, 2025) | Revenue (est.) NT$19.7b (FY, 2025) |
Cost of goods | Cost of goods ₩34.3b (FY, 2023) | Cost of goods ₩5.2b (FY, 2021) | Cost of goods ¥779.6m (FY, 2025) | Cost of goods N/A | Cost of goods RM325.8m (FY, 2025) | Cost of goods ¥1.9b (FY, 2025) | Cost of goods ¥14.9b (FY, 2025) | Cost of goods ¥23.8b (FY, 2025) | Cost of goods NT$14.9b (FY, 2025) | Cost of goods $476.1m (FY, 2025) | Cost of goods NT$13.9b (FY, 2025) | Cost of goods NT$15.7b (FY, 2025) |
Gross profit | Gross profit ₩27.4b (FY, 2023) | Gross profit ₩2b (FY, 2021) | Gross profit ¥684.9m (FY, 2025) | Gross profit N/A | Gross profit RM532.9m (FY, 2025) | Gross profit ¥2b (FY, 2025) | Gross profit ¥2.2b (FY, 2025) | Gross profit ¥4b (FY, 2025) | Gross profit NT$20.4b (FY, 2025) | Gross profit $308.9m (FY, 2025) | Gross profit NT$8b (FY, 2025) | Gross profit NT$4.1b (FY, 2025) |
Net income | Net income (₩14b) (FY, 2023) | Net income ₩30.2m (FY, 2021) | Net income ¥369.3m (FY, 2025) | Net income N/A | Net income RM131.7m (FY, 2025) | Net income ¥534.4m (FY, 2025) | Net income ¥806.4m (FY, 2025) | Net income ¥1.4b (FY, 2025) | Net income NT$8b (FY, 2025) | Net income $54.4m (FY, 2025) | Net income NT$2.8b (FY, 2025) | Net income NT$1.4b (FY, 2025) |
Operating ⚠ | ||||||||||||
Certifications | Certifications N/A | Certifications N/A | Certifications N/A | Certifications N/A | Certifications N/A | Certifications N/A | Certifications N/A | Certifications 7 (Jan, 2024) | Certifications 22 (Jul, 2023) | Certifications N/A | Certifications N/A | Certifications N/A |
Certifications and Accreditations | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations N/A | Certifications and Accreditations 32 (Jul, 2023) | Certifications and Accreditations 11 (Jun, 2023) |
Production Capacity, pieces | Production Capacity, pieces N/A | Production Capacity, pieces N/A | Production Capacity, pieces N/A | Production Capacity, pieces N/A | Production Capacity, pieces N/A | Production Capacity, pieces N/A | Production Capacity, pieces N/A | Production Capacity, pieces N/A | Production Capacity, pieces 750 k (Jul, 2023) | Production Capacity, pieces N/A | Production Capacity, pieces N/A | Production Capacity, pieces 2.5 b (FY, 2019) |

China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services.
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