Lingsen Lingsen Precision Industries (菱生精密工業股份有限公司) is a provider of semiconductor and electronic components. | ![]() China Wafer Level CSP China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services. | ||
Founding Date | Founding Date 1986 | Founding Date 1970 | Founding Date 2005 |
Type | Type Public | Type Public | Type Public |
Tags | |||
Locations | Locations HQ | Locations Taichung, TW HQ Milpitas, US | Locations Suzhou, CN HQ Palo Alto, US |
Employees | Employees N/A | Employees 2,8151% decrease | Employees 9974% increase |
Valuation ($) | Valuation ($) 513.8 m | Valuation ($) N/A | Valuation ($) 2.4 b |
Financial | |||
Revenue (est.) | Revenue (est.) ¥1.6b (FY, 2025) | Revenue (est.) NT$5.6b (FY, 2025) | Revenue (est.) ¥1.5b (FY, 2025) |
Cost of goods | Cost of goods ¥1.3b (FY, 2025) | Cost of goods NT$4.9b (FY, 2025) | Cost of goods ¥779.6m (FY, 2025) |
Gross profit | Gross profit ¥346.1m (FY, 2025) | Gross profit NT$705.5m (FY, 2025) | Gross profit ¥684.9m (FY, 2025) |
Net income | Net income ¥154.4m (FY, 2025) | Net income (NT$418.1m) (FY, 2025) | Net income ¥369.3m (FY, 2025) |
Lingsen Precision Industries (菱生精密工業股份有限公司) is a provider of semiconductor and electronic components.
View company
China Wafer Level CSP (WLCSP, 苏州晶方半导体科技) is a provider of semiconductor packaging manufacturing and testing services.
View company