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Winbond
Stock Price
NT$19.2
2024-10-29
Market Capitalization
NT$86.4 B
2024-10-28
Revenue
NT$89.4 B
FY, 2025
Winbond Summary
Company Summary
- Overview
- Winbond Electronics (華邦電子股份有限公司) is a company that provides semiconductor memory solutions. It offers specialty and mobile dynamic random access memory (DRAM), code storage flash memory, and secure flash products. The company caters to the automotive, industrial, communication, computer, and consumer markets.
- Type
- Public
- Status
- Active
- Founded
- 1987
- HQ
- Taichung, TW | view all locations
- Website
- https://www.winbond.com
- Cybersecurity rating
- ESG rating
Table of Contents
Key People
Tung-Yi Chan, Vice Chairman & Deputy CEO
Pei-Lin Pai, CTO of Advanced Technology Development Group
Pei-Ming Chen, President
Operating MetricsView all
Sales Volume (Die Production, Export), pieces
6.1B
32.5%
FY, 2023
Sales Volume (Die Production, Domestic), pieces
943.8M
8.0%
FY, 2023
Sales Volume (Domestic), wafers
125K
18.8%
FY, 2023
LocationsView all
16 locations detected
Taichung, Taichung City HQ
Taiwan
No. 8, Keya 1st Rd., Daya Dist., Central Taiwan Science Park
Pleasanton, CA
United States
5934 Gibraltar Drive, Suite 200
San Jose, CA
United States
2727 North First Street
Kunshan
China
Room 1206, kingboard Plaza (Building B, 12 floor), No. 505, Guangming Road
Shenzhen, Guang Dong Sheng
China
8F Microprofit Building, Gaoxinnan 6 Road, High-Tech Industrial Park
München, BY
Germany
Konrad-Zuse-Platz 8
Winbond Financials
Summary Financials
- Revenue (Q1, 2026)
- NT$38.3B
- Gross profit (Q1, 2026)
- NT$23.8B
- Net income (Q1, 2026)
- NT$10.1B
- Cash (Q1, 2026)
- NT$25.5B
- EBIT (Q1, 2026)
- NT$12.6B
- Enterprise value
- $137.1B