The Viscom AG is a German company domiciled in Hanover, supplying inspection systems for automated optical inspection (AOI) and automated x-ray inspection (AXI). Viscom inspection systems are used in automotive electronics, aeronautics, aerospace, industrial electronics and in the semiconductor industries.HistoryViscom was founded in 1984 by Dr. Martin Heuser and Volker Pape. At its start, Viscom developed software for industrial image processing. After relocating to its current location in Hanover-Badenstedt in 1992, serial production of inspection systems for PCB assembly began. In addition to automatic optical inspection, 1995 saw the introduction of microfocus X-ray inspection and the first system worldwide to combine inspection under incident light and X-ray, establishing another main pillar for Viscom. 1998 brought the founding of branches in the USA and Singapore. With microsystem inspection, a further business sector was secured in 2001. In the same year, Viscom changed its corporate form to a German stock corporation (AG) before its initial listing on the stock market in May 2006. Since August 2007, Viscom has also offered systems for semiconductor inspection.Corporate StructureThe Viscom AG is listed on the German stock exchange and maintains the following branches: Viscom Inc., Atlanta, USAViscom Machine Vision Pte Ltd., SingaporeViscom Machine Vision Trading Co. Ltd., Shanghai, ChinaViscom France S.A.R.L., Paris, FranceViscom Tunisie S.A.R.L., Tunis, TunisiaProductsThe Viscom product spectrum includes four areas: Optical and X-ray serial inspection systems for solder paste inspection, assembly inspection, solder joint inspection and 3D X-ray inspection.X-ray technology special inspection systems for non-destructive material inspection (NDT inspection) and 3D microfocus computed tomography (µCT).Optical special inspection systems for bare board inspection, wire bond inspection, conformal coating inspection and customer-specific inspection solutions.Semiconductor inspection systems to inspect MEMS, FlipChips, etc. and for bare wafer 3D checks.
Market capitalization (26-May-2017)
Closing share price (26-May-2017)