Jiangxi Firstar Panel Technology Jiangxi Firstar Panel Technology (江西星星科技股份有限公司, formerly known as Zhejiang Firstar Panel Technology, 浙江星星科技股份有限公司) is a company that engages in the development and manufacture of consumer electronics components. | ![]() Tong Hsing Electronic Industries Tong Hsing Electronic Industries (同欣電子工業股份有限公司) is a manufacturer of thick film substrates and semiconductor micro-module packaging. | Lakewood Instruments Lakewood Instruments is a designer and manufacturer of cooling tower and boiler systems. | |||
Founding Date | Founding Date 1923 | Founding Date 2003 | Founding Date 1974 | Founding Date 1974 | Founding Date 1973 |
Type | Type Subsidiary | Type Public | Type Public | Type Public | Type Private |
Tags | |||||
Locations | Locations Mount Hope, US HQ | Locations Pingxiang City, CN HQ Dongguan, CN Taizhou, CN Zhuhai, CN | Locations HK HQ | Locations New Taipei, TW HQ Calamba, PH Taoyuan, TW Taoyuan, TW Zhubei, TW | Locations Milwaukee, US HQ |
Employees | Employees 1631% decrease | Employees 1,590 | Employees 4,006 | Employees 2,985 | Employees 12 |
Financial | |||||
Revenue (est.) | Revenue (est.) N/A | Revenue (est.) ¥1.5b (FY, 2025) | Revenue (est.) $4b (FY, 2025) | Revenue (est.) NT$11.5b (FY, 2025) | Revenue (est.) N/A |
Cost of goods | Cost of goods N/A | Cost of goods ¥1.3b (FY, 2025) | Cost of goods $3.2b (FY, 2025) | Cost of goods NT$7b (FY, 2025) | Cost of goods N/A |
Gross profit | Gross profit N/A | Gross profit ¥174.1m (FY, 2025) | Gross profit $791.8m (FY, 2025) | Gross profit NT$4.7b (FY, 2025) | Gross profit N/A |
Net income | Net income N/A | Net income (¥31.9m) (FY, 2025) | Net income $90.3m (FY, 2025) | Net income NT$1.6b (FY, 2025) | Net income N/A |
Jiangxi Firstar Panel Technology (江西星星科技股份有限公司, formerly known as Zhejiang Firstar Panel Technology, 浙江星星科技股份有限公司) is a company that engages in the development and manufacture of consumer electronics components.
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Tong Hsing Electronic Industries (同欣電子工業股份有限公司) is a manufacturer of thick film substrates and semiconductor micro-module packaging.
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