Subtron Technology (旭德科技股份有限公司) is a company engaged in the manufacture, processing, and distribution of integrated circuit (IC) substrates. It offers a radiofrequency system in package (RF SiP), light-emitting diode (LED) lighting, optical communication module (OCM), sensors, plastic ball grid array (PBGA), chip-scale package (CSP), thin profile fine pitch ball grid array (TFBGA), etc. The company also produces tape automatic bonding (TAB) and chip on film (COF) packaging.