SPIL (Siliconware Precision Industries, 矽品精密工業股份有限公司) is a provider of semiconductor packages. It offers small-outline packages (SOPs) and quad-flat packages (QFPs) with wire bond and flip-chip interconnections such as QFN (quad-flat no-leads), TFBGA (thin fine-pitch ball grid arrays), PBGA (plastic ball grid arrays), stacked-die chip scale packages (CSP), wafer-level CSPs, etc. The company also delivers design, assembly, and testing services.