![]() Chipbond Chipbond Technology (頎邦科技股份有限公司) is a company that provides backend assembly processing services for LCD driver integrated circuits. | ||
Founding Date | Founding Date 1959 | Founding Date 1997 |
Type | Type Public | Type Public |
Tags | ||
Locations | Locations Plano, US HQ Shanghai, CN Shen Zhen, CN München, DE Tokyo, JP Seongnam, KR Milpitas, US | Locations Hsinchu, TW HQ Baoshan, TW Hsinchu, TW Hukou, TW Kaohsiung, TW Kaohsiung, TW |
Employees | Employees 7,9892% increase | Employees 5,1882% decrease |
Financial | ||
Revenue (est.) | Revenue (est.) $1.5b (FY, 2025) | Revenue (est.) NT$21.5b (FY, 2025) |
Cost of goods | Cost of goods $1b (FY, 2025) | Cost of goods NT$13.9b (FY, 2025) |
Gross profit | Gross profit $462.4m (FY, 2025) | Gross profit NT$8b (FY, 2025) |
Net income | Net income $69.2m (FY, 2025) | Net income NT$2.8b (FY, 2025) |

Chipbond Technology (頎邦科技股份有限公司) is a company that provides backend assembly processing services for LCD driver integrated circuits.
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