Nordson Dage is a company that provides of bond tester, X-ray inspection, and X-ray component counting systems for destructive and non-destructive testing, inspection, quality control, and inventory management. It develops products for testing wire bonds on semiconductor packages such as ball grid arrays, chip scale packages (CSP), and other electronic components. The company serves printed circuit board assembly (PCBA) and semiconductor industries. Nordson Dage merged with Nordson Test and Inspection Americas.