![]() KUMKANG QUARTZ KUMKANG QUARTZ (금강쿼츠) is a provider of quartz products for the semiconductor industry. | SASIB SASIB Molds, Dies and Spare Parts Manufacturing (شركة ساسب للقوالب وقطع الغيار المحدوده) is a producer of precision mechanical spare parts. | ![]() TechnoPlus Industries TechnoPlus Industries is a company that specializes in machining mechanical parts. | ![]() Advanced Component Labs Advanced Component Labs (ACL) is a company that specializes in the manufacturing and supply of semiconductor package substrates and interconnect components. | ||
Founding Date | Founding Date 1997 | Founding Date 1996 | Founding Date 1988 | Founding Date 1986 | Founding Date 1994 |
Type | Type Private | Type Private | Type Private | Type Subsidiary | Type Private |
Tags | |||||
Locations | Locations Hwaseong, KR HQ | Locations Dammam, SA HQ | Locations Noida, IN HQ | Locations Les Pennes-Mirabeau, FR HQ Saint Paul Lez Durance, FR | Locations Santa Clara, US HQ |
Employees | Employees 424 | Employees 1285% increase | Employees 176% increase | Employees 9120% increase | Employees 2 |
Financial | |||||
Revenue (est.) | Revenue (est.) ₩151.9b (FY, 2021) | Revenue (est.) N/A | Revenue (est.) N/A | Revenue (est.) €16.1m (FY, 2024) | Revenue (est.) N/A |
Cost of goods | Cost of goods ₩111.9b (FY, 2021) | Cost of goods N/A | Cost of goods N/A | Cost of goods €870k (FY, 2024) | Cost of goods N/A |
Gross profit | Gross profit ₩40b (FY, 2021) | Gross profit N/A | Gross profit N/A | Gross profit €15.2m (FY, 2024) | Gross profit N/A |
Net income | Net income ₩26.3b (FY, 2021) | Net income N/A | Net income N/A | Net income €16.9m (FY, 2024) | Net income N/A |
SASIB Molds, Dies and Spare Parts Manufacturing (شركة ساسب للقوالب وقطع الغيار المحدوده) is a producer of precision mechanical spare parts.
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Naina Semiconductor is a power semiconductor manufacturer.
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TechnoPlus Industries is a company that specializes in machining mechanical parts.
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Advanced Component Labs (ACL) is a company that specializes in the manufacturing and supply of semiconductor package substrates and interconnect components.
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