Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor assembly equipment. As one of the pioneers of the industry, K&S has provided customers with market leading packaging solutions for decades. In recent years K&S has expanded its product offerings through strategic acquisitions, adding die bonding, wedge bonding and a broader range of expendable tools to its core ball bonding products. Kulicke & Soffa, incorporated in 1951 and comprising of approximately 2,200 employees worldwide, provides equipment and tools that are used in the production of a wide range of semiconductor devices. Our customers produce the "chips" that drive the information economy and enable products such as computers, smart phones, media tablets, LED TVs, and pacemakers.
Through the use of all of our resources, primarily the incredibly talented and skilled members of our leadership team and our workforce, we are able to effectively and continuously market our products and services to both contract manufacturers and integrated device manufacturers for a wide range of applications. We offer a diverse and comprehensive array of solutions suited to any potential need of all potential customers across the globe. We are a customer centric organization with a proven track record of delivering innovative, high quality and cost effective products.
There are few awards that are as prestigious as the ones received by various manufacturers every year in the electronics realm, and we have accepted a few that prove our strategies for success are firmly set in place.
APA 2008 Best New Product Award
The K&S IConn High Performance Ball Bonder won the 2008 Advanced Packaging Award in the category of Best New Prodct in Wire Bonding Equipment and Materials
APA 2006 Best New Product Award The K&S Maxµm Ultra High Performance Ball Bonder won the 2008 Advanced Packaging Award in the category of Best New Prodct in Wire Bonding Equipment and Materials
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