Kinsus Interconnect Technology (景碩科技股份有限公司) is a company that researches, develops, manufactures, and sells electronic products. It offers SiP (System In Package) substrate, FCCSP (Flip Chip Chip Scale Package), PBGA (Plastic Ball Grid Array), CSP (Wire Bond Chip Scale Package), RF modules, FCBGA (Flip Chip Ball Grid Array), and other chips. The company caters to the semiconductor, telecommunication, electronic sectors.