Icera has developed a high performance soft modem technology for mobile broadband phone and data devices. These include mobile broadband datacards and USB sticks, cellular modules for laptops and mobile internet devices (MIDs). In addition, Iceraâ€™s soft modem provides the ideal slim modem for high performance smartphones.
Providing the highest performance 3G HSDPA and HSUPA data rates at low power and cost, Icera's platform solutions give manufacturers maximum flexibility to deliver differentiated, high performance mobile broadband devices in the shortest time possible.
The company, founded in 2002 by a highly experienced group of semiconductor executives, is staffed by a team with world leading expertise in custom processor design, wireless algorithm development, CMOS RF design and wireless handset platform integration.
Icera, which has raised venture funding totalling over $300M to date, is headquartered in Bristol UK, with design locations in the UK, France, Canada and US with sales and support in Japan, Taiwan, Korea, the US and Europe.