Grinding and Dicing Services Competitors and Similar CompaniesClear all
Grinding and Dicing Services's competitors and similar companies include Winbond and Xi'an UniIC Semiconductors.
 Grinding and Dicing Services Grinding and Dicing Services (also known as GDSI) is a company specialized in semiconductors and related solid-state devices manufacturing. |  Xi'an UniIC Semiconductors Xi'an UniIC Semiconductors (西安紫光国芯半导体有限公司, formerly known as Xi’an Sinochip Semiconductors, Qimonda Technologies) is a company that provides dynamic random access memory (DRAM) technologies. | ||
Founding Date | Founding Date 1992 | Founding Date 1987 | Founding Date 2006 |
Type | Type Private | Type Public | Type Subsidiary |
Tags | |||
Locations | Locations San Jose, US HQ | Locations Taichung, TW HQ Kunshan, CN Shenzhen, CN München, DE Hong Kong, HK Herzliya, IL Nagaokakyo, JP see more | Locations Xi'An, CN HQ Shanghai, CN Shenzhen, CN Hsinchu, TW |
Employees | Employees 6 | Employees 7,950 | Employees 600 |
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Winbond
HQ
Taichung, TW
Employees
7,950
Winbond Electronics (華邦電子股份有限公司) is a company that provides semiconductor memory solutions.
View companyXi'an UniIC Semiconductors
HQ
Xi'An, CN
Xi'an UniIC Semiconductors (西安紫光国芯半导体有限公司, formerly known as Xi’an Sinochip Semiconductors, Qimonda Technologies) is a company that provides dynamic random access memory (DRAM) technologies.
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