Grinding and Dicing Services Competitors and Similar CompaniesClear all

Grinding and Dicing Services's competitors and similar companies include Winbond and ADTechnology.

	Grinding and Dicing Services Grinding and Dicing Services (also known as GDSI) is a company specialized in semiconductors and related solid-state devices manufacturing.	Winbond Winbond Electronics (華邦電子股份有限公司) is a company that provides semiconductor memory solutions.	ADTechnology ADTechnology ((주)에이디테크놀로지) is a company that provides IT technology and system semiconductor development services.
Founding Date	Founding Date 1992	Founding Date 1987	Founding Date 2002
Type	Type Private	Type Public	Type Public
Tags	Tags Technology consumer products & services electronic components electronics semiconductors	Tags Technology electronic components electronics semiconductors	Tags Technology electronic components electronics semiconductors
Locations	Locations San Jose, US HQ	Locations Taichung, TW HQ Kunshan, CN Shenzhen, CN München, DE Hong Kong, HK Herzliya, IL Nagaokakyo, JP see more	Locations Suwon, KR HQ Unterschleißheim, DE Seongnam, KR San Jose, US Ho Chi Minh, VN Ho Chi Minh City, VN
Employees	Employees 6	Employees 7,950	Employees 3832% increase
Financial
Revenue (est.)	Revenue (est.) N/A	Revenue (est.) NT$89.4b (FY, 2025)	Revenue (est.) ₩164.5b (FY, 2025)
Cost of goods	Cost of goods N/A	Cost of goods NT$45.5b (FY, 2025)	Cost of goods ₩128.6b (FY, 2025)
Gross profit	Gross profit N/A	Gross profit NT$44.3b (FY, 2025)	Gross profit ₩36b (FY, 2025)
Net income	Net income N/A	Net income NT$3.2b (FY, 2025)	Net income ₩3.6b (FY, 2025)