Beijing ESWIN Technology Group (北京奕斯伟科技集团有限公司) is a semiconductor products and services supplier with its core businesses in integrated circuit (IC) and solutions, silicon materials, advanced packaging, and testing. Its IC and solutions business focuses on mobile devices, smart homes, smart transportation, industrial IoT, and other application scenarios, providing customers with IC and solutions in six categories, i.e. multimedia system, smart computing, smart connectivity, display interaction, automotive system, and power management. The silicon materials business offers 12-inch monocrystalline silicon polished wafers and epitaxial wafers. The packaging and testing business division includes specific IC packaging and testing, chip-on-film (COF) tape, and panel-level packaging and testing.