Boschman Competitors and Similar CompaniesClear all

Boschman's competitors and similar companies include Sensonor, Temp-Pro and WINPAC.

	Boschman Boschman Advanced Packaging Technology is a company that develops and supplies packaging equipment for electronic components.	Sensonor Sensonor Technologies is a company that manufactures high precision MEMS sensors.	Temp-Pro Temp-Pro is a manufacturer and supplier of temperature sensors.	WINPAC WINPAC ( Winner in Package and Test 윈팩) is a company that manufactures and sells semiconductor packaging and testing solutions.
Founding Date	Founding Date 1987	Founding Date 1965	Founding Date 1972	Founding Date 2002
Type	Type Private	Type Subsidiary	Type Private	Type Public
Tags	Tags Manufacturing & Industrial manufacturing equipment	Tags Manufacturing & Industrial consumer products & services electronics packaging sensors	Tags Manufacturing & Industrial cables distribution packaging sensors	Tags Manufacturing & Industrial electronic components packaging semiconductors sensors simulation
Locations	Locations Duiven, NL HQ Singapore, SG	Locations Horten, NO HQ Orlando, US	Locations Northampton, US HQ	Locations Yongin-si, KR HQ
Employees	Employees 851% decrease	Employees 522% decrease	Employees 405% decrease	Employees 5191% increase
Financial
Revenue (est.)	Revenue (est.) N/A	Revenue (est.) kr138.9m (FY, 2024)	Revenue (est.) N/A	Revenue (est.) ₩74.1b (FY, 2024)
Cost of goods	Cost of goods N/A	Cost of goods kr31m (FY, 2024)	Cost of goods N/A	Cost of goods ₩90.9b (FY, 2024)
Gross profit	Gross profit N/A	Gross profit kr108m (FY, 2024)	Gross profit N/A	Gross profit (₩16.6b) (FY, 2024)
Net income	Net income N/A	Net income kr3.4m (FY, 2024)	Net income N/A	Net income (₩30b) (FY, 2024)