Boschman Competitors and Similar CompaniesClear all
Boschman's competitors and similar companies include Temp-Pro and WINPAC.
 Boschman Boschman Advanced Packaging Technology is a company that develops and supplies packaging equipment for electronic components. |  WINPAC WINPAC ( Winner in Package and Test 윈팩) is a company that manufactures and sells semiconductor packaging and testing solutions. | ||
Founding Date | Founding Date 1987 | Founding Date 1972 | Founding Date 2002 |
Type | Type Private | Type Private | Type Public |
Tags | |||
Locations | Locations Duiven, NL HQ Singapore, SG | Locations Northampton, US HQ | Locations Yongin-si, KR HQ |
Employees | Employees 851% decrease | Employees 405% decrease | Employees 5191% increase |
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Temp-Pro
HQ
Northampton, US
Employees
40↓ 5% decrease
Temp-Pro is a manufacturer and supplier of temperature sensors.
View companyWINPAC
HQ
Yongin-si, KR
Employees
519↑ 1% increase
WINPAC ( Winner in Package and Test 윈팩) is a company that manufactures and sells semiconductor packaging and testing solutions.
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