Beijing Atom Robotics Technology Competitors and Similar CompaniesClear all
Beijing Atom Robotics Technology's competitors and similar companies include Mega-Fabs Motion Systems, Qualinx, ASYGN and Tezzaron Semiconductor.
 Beijing Atom Robotics Technology Beijing Atom Robotics Technology is a company providing sensor products for robotics. |  Mega-Fabs Motion Systems Mega-Fabs Motion Systems is a company that develops and markets software-intensive programmable DSP-based motion control products. |  Qualinx Qualinx is a semiconductor company that solves high power consumption problem of GNSS sensors using digital RF (DRF) technology. |  ASYGN ASYGN is a provider of ICs and system solutions for industrial consumer, defense, and automotive applications. |  Tezzaron Semiconductor Tezzaron Semiconductor is a company specialized in wafer-stacked 3D-ICs with through-silicon interconnect, including microprocessors, sensors, and SRAM devices. | |
Founding Date | Founding Date 2015 | Founding Date 2000 | Founding Date 2015 | Founding Date 2008 | Founding Date 1999 |
Type | Type Private | Type Subsidiary | Type Private | Type Private | Type Private |
Tags | |||||
Locations | Locations Beijing, CN HQ | Locations Yokneam Illit, IL HQ | Locations Delft, NL HQ | Locations Grenoble, FR HQ | Locations Austin, US HQ |
Employees | Employees 20 | Employees 19 | Employees 4014% increase | Employees 49 | Employees 17 |
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Mega-Fabs Motion Systems
HQ
Yokneam Illit, IL
Mega-Fabs Motion Systems is a company that develops and markets software-intensive programmable DSP-based motion control products.
View companyQualinx
HQ
Delft, NL
Employees
40↑ 14% increase
Qualinx is a semiconductor company that solves high power consumption problem of GNSS sensors using digital RF (DRF) technology.
View companyASYGN
HQ
Grenoble, FR
Employees
49
ASYGN is a provider of ICs and system solutions for industrial consumer, defense, and automotive applications.
View companyTezzaron Semiconductor
HQ
Austin, US
Employees
17
Tezzaron Semiconductor is a company specialized in wafer-stacked 3D-ICs with through-silicon interconnect, including microprocessors, sensors, and SRAM devices.
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