World's leading provider of Laser Dicing and Grooving Systems
ASM Laser Separation International B.V.(ALSI), is the inventor of laser dicing and grooving and the world's leading provider of laser dicing and grooving systems for the semiconductor industry. The process is based on a unique multi beam laser dicing technology.
The multi laser beam dicing process is the technology with very low thermal impact while having a very high productivity. ASM ALSI’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.