Wuxi Shangji Automation Competitors and Similar CompaniesClear all
Naintech's competitors and similar companies include Fujii Seiko, ACCRETECH (Europe) and Advanced Dicing Technologies.
 Naintech Naintech ((주)나인텍) is a company specializing in the development and manufacture of semiconductor components, plant automation equipment, medical instruments and devices, and components. |  Fujii Seiko Fujii Seiko (藤井精工株式会社 or フジイセイコウ) is a manufacturer of ultra-precision molds, semiconductors, electrical and electronic parts. |  ACCRETECH (Europe) ACCRETECH (Europe) is a provider of industrial measuring technology and the latest equipment for the semiconductor industry. |  Advanced Dicing Technologies Advanced Dicing Technologies (ADT, טכנולוגיות חיתוך מתקדמות) is a company specializing in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based integrated circuits (ICs), package singulation, and hard material microelectronic components (MEC). | |
Founding Date | Founding Date 2000 | Founding Date 1976 | Founding Date 1949 | Founding Date 2003 |
Type | Type Public | Type Private | Type Subsidiary | Type Private |
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Locations | Locations Ansan-si, KR HQ | Locations Kurate, JP HQ | Locations Coventry, GB HQ München, DE München, DE | Locations Yokne'am Illit, IL HQ Shanghai, CN New Taipei, TW Horsham, US |
Employees | Employees 15622% increase | Employees 79 | Employees 141 | Employees 51 |
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Fujii Seiko
HQ
Kurate, JP
Employees
79
Fujii Seiko (藤井精工株式会社 or フジイセイコウ) is a manufacturer of ultra-precision molds, semiconductors, electrical and electronic parts.
View companyACCRETECH (Europe)
HQ
Coventry, GB
ACCRETECH (Europe) is a provider of industrial measuring technology and the latest equipment for the semiconductor industry.
View companyAdvanced Dicing Technologies
HQ
Yokne'am Illit, IL
Employees
51
Advanced Dicing Technologies (ADT, טכנולוגיות חיתוך מתקדמות) is a company specializing in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based integrated circuits (ICs), package singulation, and hard material microelectronic components (MEC).
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