UNISEM Competitors and Similar CompaniesClear all
UNISEM's competitors and similar companies include ACCRETECH (Europe), El Camino Technologies and Advanced Dicing Technologies.
 UNISEM UNISEM (유니셈, also known as Unisem Semiconductor Equipment) is a company that provides semiconductor equipment. |  ACCRETECH (Europe) ACCRETECH (Europe) is a provider of industrial measuring technology and the latest equipment for the semiconductor industry. |  El Camino Technologies El Camino Technologies is a company that provides products, solutions and services for semiconductor and solar technologies. |  Advanced Dicing Technologies Advanced Dicing Technologies (ADT, טכנולוגיות חיתוך מתקדמות) is a company specializing in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based integrated circuits (ICs), package singulation, and hard material microelectronic components (MEC). | |
Founding Date | Founding Date 1988 | Founding Date 1949 | Founding Date 1989 | Founding Date 2003 |
Type | Type Public | Type Subsidiary | Type Private | Type Private |
Tags | ||||
Locations | Locations Hwaseong-si, KR HQ Shangahi, CN Xian Shi, CN Cheongju, KR Hwaseong Si, KR Icheon Si, KR Paju Si, KR see more | Locations Coventry, GB HQ München, DE München, DE | Locations Bengaluru, IN HQ | Locations Yokne'am Illit, IL HQ Shanghai, CN New Taipei, TW Horsham, US |
Employees | Employees 7863% increase | Employees 141 | Employees 9 | Employees 51 |
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ACCRETECH (Europe)
HQ
Coventry, GB
ACCRETECH (Europe) is a provider of industrial measuring technology and the latest equipment for the semiconductor industry.
View companyEl Camino Technologies
HQ
Bengaluru, IN
Employees
9
El Camino Technologies is a company that provides products, solutions and services for semiconductor and solar technologies.
View companyAdvanced Dicing Technologies
HQ
Yokne'am Illit, IL
Employees
51
Advanced Dicing Technologies (ADT, טכנולוגיות חיתוך מתקדמות) is a company specializing in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based integrated circuits (ICs), package singulation, and hard material microelectronic components (MEC).
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