UNISEM Competitors and Similar CompaniesClear all

ACCRETECH (Europe)'s competitors and similar companies include NANO-MASTER, El Camino Technologies and Advanced Dicing Technologies.
ACCRETECH (Europe)
ACCRETECH (Europe)
ACCRETECH (Europe) is a provider of industrial measuring technology and the latest equipment for the semiconductor industry.
NANO-MASTER
NANO-MASTER
NANO-MASTER is a manufacturer of single wafer-thin film processing systems.
El Camino Technologies
El Camino Technologies
El Camino Technologies is a company that provides products, solutions and services for semiconductor and solar technologies.
Advanced Dicing Technologies
Advanced Dicing Technologies
Advanced Dicing Technologies (ADT, טכנולוגיות חיתוך מתקדמות) is a company specializing in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based integrated circuits (ICs), package singulation, and hard material microelectronic components (MEC).
Founding Date
Founding Date
1949
Founding Date
1992
Founding Date
1989
Founding Date
2003
Type
Type
Subsidiary
Type
Subsidiary
Type
Private
Type
Private
Tags
Locations
Locations
Coventry, GB HQ
München, DE
München, DE
Locations
Austin, US HQ
Locations
Bengaluru, IN HQ
Locations
Yokne'am Illit, IL HQ
Shanghai, CN
New Taipei, TW
Horsham, US
Employees
Employees
141
Employees
10
Employees
9
Employees
51
For sources of this data, please see the company profile

View Company Profiles

NANO-MASTER
HQ
Austin, US

NANO-MASTER is a manufacturer of single wafer-thin film processing systems.

View company
El Camino Technologies
HQ
Bengaluru, IN
Employees
9

El Camino Technologies is a company that provides products, solutions and services for semiconductor and solar technologies.

View company
Advanced Dicing Technologies
HQ
Yokne'am Illit, IL
Employees
51

Advanced Dicing Technologies (ADT, טכנולוגיות חיתוך מתקדמות) is a company specializing in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based integrated circuits (ICs), package singulation, and hard material microelectronic components (MEC).

View company