![]() Richardson Electronics Richardson Electronics is a company that manufactures and distributes power conversion, RF, and microwave components. | ![]() Broadcom Broadcom (formerly Avago Technologies) is a company that designs, develops, and supplies semiconductor and infrastructure software solutions. | ![]() Teledyne Micropac Teledyne Micropac (formerly known as Micropac Industries) is a company that designs, manufactures, and distributes optoelectronic components, assemblies, and multi-chip microelectronic modules. | |
Founding Date | Founding Date 1947 | Founding Date 1991 | Founding Date 1963 |
Type | Type Public | Type Public | Type Subsidiary |
Tags | |||
Locations | Locations La Fox, US HQ Victoria, AU São Paulo, BR Toronto, CA Beijing, CN Nanjing, CN Shanghai, CN see more | Locations Palo Alto, US HQ Yerevan, AM Canberra, AU North Sydney, AU Wien, AT Eke Nazareth, BE Mechelen, BE see more | Locations Garland, US HQ |
Employees | Employees 3963% decrease | Employees 33,00011% decrease | Employees 1022% increase |
Valuation ($) | Valuation ($) 204.2 m | Valuation ($) 837.2 b | Valuation ($) N/A |
Financial | |||
Revenue (est.) | Revenue (est.) $208.9m (FY, 2025) | Revenue (est.) $63.9b (FY, 2025) | Revenue (est.) $30.6m (FY, 2023) |
Cost of goods | Cost of goods $144.1m (FY, 2025) | Cost of goods $20.6b (FY, 2025) | Cost of goods $19.8m (FY, 2023) |
Gross profit | Gross profit $64.8m (FY, 2025) | Gross profit $43.3b (FY, 2025) | Gross profit $10.9m (FY, 2023) |
Net income | Net income ($1.1m) (FY, 2025) | Net income $23.1b (FY, 2025) | Net income $632k (FY, 2023) |
Operating ⚠ | |||
Facility Space, sq. ft. | Facility Space, sq. ft. 224 m (FY, 2023) | Facility Space, sq. ft. 7.1 m (FY, 2024) | Facility Space, sq. ft. N/A |

Broadcom (formerly Avago Technologies) is a company that designs, develops, and supplies semiconductor and infrastructure software solutions.
View company
Teledyne Micropac (formerly known as Micropac Industries) is a company that designs, manufactures, and distributes optoelectronic components, assemblies, and multi-chip microelectronic modules.
View company