CorePhotonics competitorsClear all

CorePhotonics's top competitors include Finger Lakes Instrumentation, Fabrinet and US Conec.
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CorePhotonics
CorePhotonics
Corephotonics is a compact camera design house with computational photography expertise. It develops state of the art solutions based on unique algorithms and novel compact camera designs and components.
Finger Lakes Instrumentation
Finger Lakes Instrumentation
Finger Lakes Instrumentation is a company manufacturing cooled CCD cameras, atlas focusers, centerline filter wheels, and high speed filter wheels.
Fabrinet
Fabrinet
Fabrinet specializes in precision optical, electro-optical, sophisticated electronic PCBA and electro-mechanical process technologies for high-mix, any-volume production.
US Conec
US Conec
US Conec is a company that provides passive components for high-density optical interconnects.
Founding Date
Founding Date
2012
Founding Date
1998
Founding Date
2000
Founding Date
1992
Type
Type
Subsidiary
Type
Subsidiary
Type
Public
Type
Private
Tags
Locations
Locations
Tel Aviv-Yafo, IL HQ
Locations
Lima, US HQ
Locations
Patumthanee, TH HQ
Fuzhou, CN
Chuo City, JP
Wiltshire, GB
Mountain Lakes, US
Santa Clara, US
Locations
Hickory, US HQ
Employees
Employees
68
Employees
12
Employees
11,67010% increase
Employees
1112% increase
Alexa Website Rank
Alexa Website Rank
N/A
Alexa Website Rank
254241
Alexa Website Rank
440174
Alexa Website Rank
198369
Employee Rating
Employee Rating
4
Employee Rating
3
Employee Rating
3.7
Employee Rating
N/A
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Finger Lakes Instrumentation
HQ
Lima, US

Finger Lakes Instrumentation is a company manufacturing cooled CCD cameras, atlas focusers, centerline filter wheels, and high speed filter wheels.

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Fabrinet
HQ
Patumthanee, TH
Employees
11,670↑ 10% increase

Fabrinet specializes in precision optical, electro-optical, sophisticated electronic PCBA and electro-mechanical process technologies for high-mix, any-volume production.

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US Conec
HQ
Hickory, US
Employees
111↑ 2% increase

US Conec is a company that provides passive components for high-density optical interconnects.

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