Camtek Competitors and Similar CompaniesClear all
Camtek's competitors and similar companies include ProbeLeader and Advanced Dicing Technologies.
 Camtek Camtek (קמטק בע"מ) is a company that develops and manufactures inspection and metrology equipment for the semiconductor industry. |  ProbeLeader ProbeLeader (勵威電子股份有限公司, PL) is a company that designs and manufactures testing solutions for semiconductor and LCD (liquid crystal display) panel industries. |  Advanced Dicing Technologies Advanced Dicing Technologies (ADT, טכנולוגיות חיתוך מתקדמות) is a company specializing in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based integrated circuits (ICs), package singulation, and hard material microelectronic components (MEC). | |
Founding Date | Founding Date 1987 | Founding Date 2002 | Founding Date 2003 |
Type | Type Public | Type Private | Type Private |
Tags | |||
Locations | Locations Migdal HaEmek, IL HQ Suzhou, CN Munich, DE Hong Kong, HK Tokyo, JP Suwon Si, KR Singapore, SG see more | Locations Hsinchu, TW HQ Wuxi, CN Hsinchu, TW Kaohsiung, TW | Locations Yokne'am Illit, IL HQ Shanghai, CN New Taipei, TW Horsham, US |
Employees | Employees 7098% increase | Employees 35 | Employees 51 |
Financial | |||
Revenue (est.) | Revenue (est.) $496.1m (FY, 2025) | Revenue (est.) NT$770.9m (FY, 2021) | Revenue (est.) N/A |
Cost of goods | Cost of goods $234m (FY, 2025) | Cost of goods NT$529.6m (FY, 2021) | Cost of goods N/A |
Gross profit | Gross profit $262.1m (FY, 2025) | Gross profit NT$241.2m (FY, 2021) | Gross profit N/A |
Net income | Net income $50.7m (FY, 2025) | Net income NT$42.6m (FY, 2021) | Net income N/A |
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ProbeLeader
HQ
Hsinchu, TW
Employees
35
ProbeLeader (勵威電子股份有限公司, PL) is a company that designs and manufactures testing solutions for semiconductor and LCD (liquid crystal display) panel industries.
View companyAdvanced Dicing Technologies
HQ
Yokne'am Illit, IL
Employees
51
Advanced Dicing Technologies (ADT, טכנולוגיות חיתוך מתקדמות) is a company specializing in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based integrated circuits (ICs), package singulation, and hard material microelectronic components (MEC).
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