![]() Bosman Bedrijven Bosman Companies supplies building-related technical solutions in installation technology. | ![]() Mankun Technology Ji'an Mankun Technology (吉安满坤科技股份有限公司) is a manufacturer of double-layer and multi-layer circuit boards. | ![]() 3SP Technologies 3SP Technologies is a provider of optoelectronic chips and modules for telecommunications, lidars, and industrial lasers markets. | ||
Founding Date | Founding Date 1959 | Founding Date 2003 | Founding Date 1994 | Founding Date 1999 |
Type | Type Private | Type Public | Type Subsidiary | Type Private |
Tags | ||||
Locations | Locations HQ | Locations Ji'an, CN HQ | Locations Nozay, FR HQ | Locations Lillerød, DK HQ Wiesbaden, DE Staines, GB |
Employees | Employees 1482% increase | Employees 2,312 | Employees 1123% increase | Employees 72 |
Financial | ||||
Revenue (est.) | Revenue (est.) N/A | Revenue (est.) ¥1.5b (FY, 2025) | Revenue (est.) €24.8m (FY, 2023) | Revenue (est.) N/A |
Cost of goods | Cost of goods N/A | Cost of goods ¥1.4b (FY, 2025) | Cost of goods €12m (FY, 2023) | Cost of goods N/A |
Gross profit | Gross profit N/A | Gross profit ¥286.6m (FY, 2025) | Gross profit €12.8m (FY, 2023) | Gross profit N/A |
Net income | Net income N/A | Net income ¥119.5m (FY, 2025) | Net income (€4.1m) (FY, 2023) | Net income N/A |

Ji'an Mankun Technology (吉安满坤科技股份有限公司) is a manufacturer of double-layer and multi-layer circuit boards.
View company
3SP Technologies is a provider of optoelectronic chips and modules for telecommunications, lidars, and industrial lasers markets.
View companyTier1 Asset (T1A) is a provider of refurbished IT and asset recovery services.
View company